News Article
Production wafer bonding system order
SUSS MicroTec announced it has received an order for an ABC200 automated production wafer bonding system from Freescale Semiconductor.
"Silicon wafer bonding is a critical wafer level packaging technology for Freescale and a key enabling technology for the mass production of cost effective MEMS accelerometers. We chose SUSS MicroTec because of their demonstrated ability to deliver truly automated production wafer bonders to the MEMS industry", said Hemant Desai, MEMS Development Manager at Freescale.
"We are extremely pleased to win the production wafer bonder order at Freescale. It clearly shows that MEMS production customers need high productivity, automated wafer bonding solutions" said Michael Kipp, General Manager, SUSS MicroTec Wafer Bonder Division USA.