News Article
All-surface macro inspection system
Rudolph Technologies, Inc. all-surface, macro defect inspection system is best of breed.
Inspection Modules, combined with the AXi (frontside) Advanced Macro Inspection System, form an integrated all-surface solution that is the first to automatically detect, classify and correlate macro defects from the front, edge and backside of 200mm and 300mm wafers through multiple front-end processes, including deposition, lithography, etch and CMP. This integrated approach is capable of linking edge and backside "source" defects with frontside defects that can directly impact yield, without the increase in inspection time and analysis complexity that is associated with separate, standalone inspections.
"As a result of edge inspection, our all-surface customers are taking corrective actions that have reduced defects on the edge bevel and, in some cases, improved wafer final test yields by ten percent from the baseline," said Ardy Johnson, vice president of marketing for Rudolph Technologies.