News Article
AMD to invest US$2.5 Billion in 300mm microprocessing
AMD announced that it plans to expand its microprocessor manufacturing capacity over the next three years by adding additional 300 millimetre wafer production capabilities in Dresden through the implementation of three new projects.
AMD's newest fabrication facility will come online through a major transformation of the company's existing Fab 30, which will be named Fab 38. The transition from 200mm to 300mm allows for more than twice as many processors on a wafer. In addition, AMD will also expand Fab 36's existing 300mm capacity and build a new clean room facility to handle the site's growing Bump and Test requirements, which is one of the final stages of the manufacturing process where wafers are prepared to be shipped for packaging. With plans to invest a total of US$2.5 billion in the Dresden expansion projects. "As global demand continues to rise for AMD products, we are scaling our manufacturing capacity intelligently to meet our customers' growing needs." These strategic investments highlight the significance of Germany and Europe to the future of AMD said Hector Ruiz, chairman of the board and chief executive officer of AMD." AMD will ramp down 200mm manufacturing in the second half of 2007, with preparation already underway for the ramp of 300mm wafers on 65nm process technology at Fab 38 by the end of 2007. The plant will produce the latest generations of AMD microprocessors, reaching full capacity by the end of 2008. The majority of the investment will go into new equipment in the Fab 38 facility. AMD will also build a new clean room facility on its Dresden campus for Bump and Test requirements, which will support both fabrication facilities. Previously the clean room facilities for Bump and Test activities were located within Fab 30 and Fab 36. By moving them into a new facility in 2007, AMD has the ability to maximise production space at both Fab 36 and Fab 38, providing increased output and capacity. These three projects have the potential to increase Dresden-based manufacturing to a full capacity of 45,000 300mm-wafer starts per month by the end of 2008. "With the addition of Fab 36, AMD took a major step forward in increasing output and scale for its global manufacturing and with this announcement we raise the bar even further," said Daryl Ostrander, senior vice president, logic technology and manufacturing, Microprocessor Solutions Sector."
