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News Article

Hoya Selects Applied Materials' Tetra Mask Etcher

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Applied Materials, Inc. announced that its Applied Tetra II Mask Etch system has won the selection for 65nm mask applications at Hoya Corporation, used in semiconductor and LCD (liquid crystal display) production.

The tool is scheduled for installation at Hoya in mid-2006, in the company's Hachioji, Japan, facility. Asao Shikata, Chief General Manager, Mask Division of Hoya said, "The Applied Tetra II system's 65nm mask etch capabilities, especially its chrome and quartz etch performance on the latest binary and phase shift mask applications, were key reasons for our purchase of this system. This system will help Hoya continue to provide the industry advanced masks over the next several generations of photomask technology."

"We are very pleased by Hoya's choice of Applied Materials to supply its critical enabling mask etch technology as it moves to 65nm-generation photomask manufacturing," said Tom St. Dennis, senior vice president and general manager of Applied Materials' Etch, Cleans and Front End Products Group.

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