News Article
Success for 65nm Crolles work
Brion Technologies has announced the successful completion of its initial joint development agreement with the Crolles2 Alliance, enabling STMicroelectronics, Philips Semiconductors and Freescale Semiconductor to put Brion's Tachyon LMC, model-based, full-chip, through-process-window, lithography manufacturability verification solution in production on a fully automated 65nm process flow.
Brion Technologies has announced the successful completion of its initial joint development agreement with the Crolles2 Alliance, enabling STMicroelectronics, Philips Semiconductors and Freescale Semiconductor to put Brion's Tachyon LMC, model-based, full-chip, through-process-window, lithography manufacturability verification solution in production on a fully automated 65nm process flow.
Based on the success of the joint development work, which began in April 2005, the Crolles2 Alliance has placed a follow-on order for additional Tachyon capacity, including both Tachyon LMC for 65nm & 45nm RET verification and Tachyon RDI design inspection for 90nm. The alliance has also entered into a new agreement with Brion to develop OPC for 45nm devices
"Brion's Tachyon LMC model-based, full-chip verification technology fundamentally changes how we approach production of 65nm designs," said Joël Hartmann, operations director for Crolles2, based in Crolles, France. "Using Tachyon, we achieve faster and more predictable cycle times - accelerating our chip time-to-market."
Both Tachyon LMC and OPC+ use Brion's Focus Exposure Modeling (FEM) technology, a one-model, through-process-window, full-chip lithography simulation capability that serves as the basis for achieving exceptional accuracy and speed.
"We're honored to expand our working relationship with the Crolles2 Alliance team, leaders in innovation within the OPC and RET community," said Eric Chen, chief executive officer of Brion. "The success of our strategic partnership validates Brion's Tachyon computational lithography platform, which continues to lead the industry in addressing the challenge of achieving highly accurate lithography modeling and verification without compromising throughput."
Based on the success of the joint development work, which began in April 2005, the Crolles2 Alliance has placed a follow-on order for additional Tachyon capacity, including both Tachyon LMC for 65nm & 45nm RET verification and Tachyon RDI design inspection for 90nm. The alliance has also entered into a new agreement with Brion to develop OPC for 45nm devices
"Brion's Tachyon LMC model-based, full-chip verification technology fundamentally changes how we approach production of 65nm designs," said Joël Hartmann, operations director for Crolles2, based in Crolles, France. "Using Tachyon, we achieve faster and more predictable cycle times - accelerating our chip time-to-market."
Both Tachyon LMC and OPC+ use Brion's Focus Exposure Modeling (FEM) technology, a one-model, through-process-window, full-chip lithography simulation capability that serves as the basis for achieving exceptional accuracy and speed.
"We're honored to expand our working relationship with the Crolles2 Alliance team, leaders in innovation within the OPC and RET community," said Eric Chen, chief executive officer of Brion. "The success of our strategic partnership validates Brion's Tachyon computational lithography platform, which continues to lead the industry in addressing the challenge of achieving highly accurate lithography modeling and verification without compromising throughput."
