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Cree to acquire INTRINSIC Semiconductor

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Cree, Inc., announced it has signed a agreement to acquire privately held INTRINSIC Semiconductor Corporation.
Integration of INTRINSIC's technology into Cree's materials product line should accelerate development of larger-diameter, high-quality SiC wafers, which should enable new high-power semiconductor devices and lower-cost LEDs. "We are extremely pleased to be joining the Cree team," said Dr. Cengiz Balkas, president & CEO of INTRINSIC. "The contribution of INTRINSIC's ZMP process to Cree's existing SiC technology and high-volume manufacturing capability represents an opportunity to make a new generation of cost-effective SiC devices available sooner than had previously been envisioned."
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