News Article
New thick film alliance formed
Ten manufacturers of thick film microcircuits have come together to form a new alliance that will provide engineers with a central resource of information on how to use this technology and maximise its benefits in custom electronics design.
The Thick Film Alliance has been set up by companies based across the UK and Ireland. Through its formation the organisations involved intend to raise awareness of how and where thick film microcircuits can be used and the benefits the technology can offer, as well as providing practical information on design best practice.Thick film technology is currently used primarily in high reliability applications such as those required by the defence, aerospace and medical industries. However, microcircuits manufactured using this technology can be used in many other applications where they offer particular advantages.Circuits made using thick film can achieve a high packing density and are low in weight when compared with other circuit manufacturing methods. They are also robust and offer long term reliability even when used in harsh applications.There are also other, lesser known benefits of using thick film circuit boards including being biologically inert (making them suitable for use in medical implants for example) and recyclable.The manufacture of thick film electronic circuits is a long-established process. They are made by screen printing layers of conductive inks and dielectric materials onto a ceramic substrate to form circuits. Interconnection of devices by wire bonding and soldering as well as protecting components are also well proven techniques.A founder of the Thick Film Alliance is Mike Bracher, general manager at Newmarket-based Micro Circuit Engineering. He said: "With the widespread availability of printed circuit board and surface mount technology, electronic designers and engineers have become less aware of the potential offered by thick film technology."We have formed the Thick Film Alliance to help raise awareness of the benefits this technology can offer designers and to provide them with a resource to help them get the most from it."As well as providing a resource for design engineers, The Thick Film Alliance plans to help influence future generations of designers through establishing links with universities. The International Microelectronics Packaging Society (IMAPS) has also agreed to support the alliance through providing secretariat facilities and other support.
