Partnership to solve chip-package challenge
As part of this announcement, they introduced immediate availability of a jointly developed solution, a link between Rio Design Automation's RioMagic package-aware chip design software and Optimal's PakSi-E signal and power integrity software. This integration addresses the need for engineers to consider package requirements during chip design because of increased semiconductor complexity and the emergence of new technologies, such as SiP.
"Companies fast tracking the chip development cycle cannot wait until the package designer analyses 3D signal and power integrity, especially as we move into the multi-gigahertz range," says Dave DeMaria, chief executive officer (CEO) of Optimal. "Our customers see increased need for a concurrent chip/package design flow, which Rio Design Automation and Optimal have accomplished with this tight tool integration."
