SUSS MicroTec supplies 300mm coating technology
Thick resist processing is an enabling technology for volume production in wafer level packaging and solder bumping, which represent the two main markets for both companies. The system is scheduled for installation in late 2006 at AZ's photoresist manufacturing site in Branchburg, New Jersey.
In recent years, the relentless pressure for faster, lighter, and smaller electronic products has focused special attention on wafer-level packaging/solder bumping, which may be defined as a technology where all packaging and interconnection processes take place in wafer format prior to dicing.
According to Prismark Partners, a market research firm based in New York, the wafer-level packaging/solder bumping market is currently growing at a compound annual growth rate (CAGR) of 25 percent.
"It is a pleasure to work with such a high growth company as AZ Electronic Materials and to qualify their innovative photo resists on our equipment." comments Rolf Wolf, managing director of SUSS MicroTec Lithography division. "This clear endorsement from AZ Electronic Materials represents another important milestone for our 300mm equipment."
