Photronics appoints chief technology officer for Asia
In this newly created position, Dr. Choi will be directly responsible for all regional development activities designed to support Asian semiconductor photomask customers. As Photronics' recently announced Asian NanoFab comes on line, his technology development responsibilities will be extended to include day-to-day site director level management of the NanoFab's advanced technology manufacturing operations. As defined within Photronics' NanoFab strategy, NanoFab sites will report in a dual capacity to Chief Operating Officer Dr. SH Jeong with respect to volume production activities and to Dr. Christopher Progler in all matters related to technology development and transfer. As Dr. Choi's role expands to include advanced technology volume manufacturing, he will transition to the "two in a box" management structure where in addition to reporting to Dr. Progler, he will also report to Dr. Jeong.
"As our newly appointed CTO-Asia, SS brings essential management depth and technical expertise to a position that is enabling Photronics to more effectively service the needs of our rapidly evolving customers in Asia," commented Dr. Progler. "He will be playing a crucial role in how the Company is focusing on alignment and coordination between the Photronics' technology development and volume manufacturing deployment on a global basis, thus insuring that all development activities in which we are engaged are complimentary and supportive in achieving primary goals."
Over the course of his a 17-year career, Dr. Choi has held positions of increasing responsibility with the Electronic and Telecommunications Research Institute of Korea and PKL Co., Ltd. He holds B.S., M.S. and Ph.D. degrees from Kyungpook National University in Daegu. Prior to being appointed to his current position, Dr. Choi served Photronics as Executive Vice President of R&D for PKL Co., Ltd. His impressive record of achievements include his team's successful development of a haze-free process crucial to the high fidelity imaging of advanced semiconductor circuit patterns in wafer fabrication facilities utilizing advanced 193 nanometer lithography systems.
