NanoWorld selects SUSS wafer bonding system
NanoWorld Services, located in Erlangen, Germany is part of the Swiss NanoWorld Group and specializes in the development and fabrication of microtechnological products, such as probes for Scanning Probe Microscopy, based on semiconductor fabrication methods.
"Our main business is turning customer's MEMS ideas into MEMS products by providing an inherently tight integration of MEMS design, process development and production," says Joerg Diebel, CEO at NanoWorld Services. "The ELAN offers the flexibility to serve our various customers' needs as well as the precision to develop new products and processes with stringent post-bond alignment specifications."
"The ELAN was designed with customers exactly like NanoWorld in mind," says Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec. "Our manual wafer bonding solution facilitates MEMS R&D and process development, and because it uses essentially the same technology and user-friendly software as our fully automated wafer bonding cluster tools, it allows for a smooth transition to volume production."
The ELAN CB6L manual wafer bonder is designed specifically for research, development, and pre-production wafer bonding markets. It has the same core technology as the SUSS fully automated bonders – including precise temperature and force during bonding, as well as computer controlled wafer processing – to ensure high-accuracy post bond alignment. Based on field-proven wafer bonding technology and supported by world-renown SUSS engineering and applications expertise, the ELAN is well suited for MEMS, optoelectronic, advanced packaging, and SOI applications.
