News Article
Veeco receives $1.7m multi-unit order
Veeco Instruments Inc. announced that a leading semiconductor packaging manufacturer has chosen its Wyko SP3250 Optical Profiler to be used for defect inspection and in-line performance monitoring.
The customer, a leading semiconductor packaging manufacturer, placed a multi-unit order totaling $1.7 million. According to Jeannine Sargent, Executive Vice President, Veeco Metrology, "The increasing complexity and decreasing size of flip chips used for cell phones and graphic applications are driving very challenging metrology requirements. Our SP3250 offers a solution that addresses difficult measurements on circuitry and insulator layers within semiconductor packages." According to Gartner Dataquest, the outsourced chip packaging market will grow at a compound annual growth rate of approximately 12% from $18 billion in 2006 to $28 billion in 2010. Ms. Sargent added, "We see high-end semiconductor packaging as an important extended market opportunity for Veeco, which reaches beyond back end bump inspection to other forms of packaging such as organic light emitting diode panels and printed electronics."According to David Rossi, Vice President of Marketing, Veeco Metrology, "Our instrument provides unparalleled measurement capability and performance, ensuring high yield process control and maximum profitability for flip chip substrate manufacturers. We believe that the growth of the flip chip market, and the increased adoption of flip chip packaging and its close relative, chip scale packaging for logic, memory and cell phone chipsets, will continue to drive manufacturing capacity expansion through 2009."
