AMI Semiconductor and FLIR Systems sign agreement
Under the agreement, FLIR will install its proprietary microbolometer detector process at AMI Semiconductor's Class 1, eight-inch fabrication facility in Pocatello, Idaho. The agreement will expand current microbolometer detector manufacturing capability and will also provide an opportunity to improve yield by installing the process in a Class 1 fabrication facility.
"We are pleased to expand on our already successful partnership with AMIS," said Earl R. Lewis, President, CEO and Chairman of FLIR Systems. "AMIS has supplied the CMOS read-out integrated circuit (ROIC) portion of our detectors for several years. This relationship, coupled with AMI Semiconductor's expertise in custom process installations and Class 1 fabrication, makes them the logical choice as our high volume microbolometer manufacturing partner."
"This agreement deepens our existing partnership with FLIR Systems," said Chris King, AMI Semiconductor CEO. "Thermal imaging is a fast growing market in which FLIR and AMIS can develop and supply superior products. We anticipate this relationship to be a longstanding one, benefiting both companies along with FLIR's customers."
