Amkor opens new wafer bump factory in Singapore
In conjunction with its exiting probe and test facility in Singapore, Amkor now offers Singapore customers a complete suite of wafer bump, probe and final test services to support emerging flip chip applications using Common Platform advanced silicon at the 90nm and 65nm process nodes.
The new bumping facility will have an initial capacity of 8,000 wafers per month, with the potential to reach 30,000 wafers per month in the coming years.
"We established this factory in collaboration with Chartered Semiconductor Manufacturing and other Common Platform customers operating in Singapore to support the growing adoption of flip chip packaging for advanced silicon," said Oleg Khaykin, Amkor's executive vice president and chief operating officer. "Our near-term production build-out is largely supported by long-term supply agreements for both bump and probe services. This new factory complements our existing flip chip assembly and test capabilities and our association in the Common Platform ecosystem. We intend for this facility to support our most advanced 300mm bumping technologies."