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News Article

Copper slurry for IC chemical planarization to lead in 2007

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Driven by the conversion to copper interconnect materials in the Memory Sector, demand for Copper Slurry for CMP will increase 26% in 2007, according to the report CMP Technology: Competition, Products, Markets, recently published by The Information Network

"The conversion to copper damascene by DRAM and Flash manufacturers will be key to the growth of the copper market and hence the Copper CMP Slurry sector," added Dr. Castellano.

"We expect these manufacturers to start significantly increasing the use of copper interconnects in 2007. Already NOR Flash manufacturers have started the migration, and several NAND Flash manufacturers will start using copper in 2007. While Micron Technology has converted to copper interconnects, other DRAM manufacturers will start migrating to copper in late 2007 or early 2008."

Copper slurry will hold a 45% share of the $800 million CMP slurry market in 2007, up from a 37% share of the slightly less than $700 million market in 2006. In the Copper CMP slurry sector, Cabot Microelectronics held a 32% share in 2005, double that of its closest competitors Planar and Fujimi.

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