EV Group and Datacon extend cooperation on advanced-chip-to-wafer technology
The AC2W technology combines Datacon's chip-bonding and key flip- chip bonding technologies with wafer-level know-how from EV Group. It has been developed in a joint R&D project.
In the AC2W technology, single chips are temporarily placed onto a carrier wafer with high accuracy and speed by a Datacon –Flip-Chip bonder, whereas as next step, those stacked-chips are permanent bonded on wafer-scale onto an EVG-bonding system.
During the initial phase which start with the R&D project, the technology offers high device density through stacked devices, short interconnects and higher functional density for applications. The technology provides advantages for chip manufacturers by enabling the integration of various device processes such as hybrid integration of IC and MEMS functionality.
Advanced-chip-to-wafer-technology (AC2W) can generate packages that are an alternative to expensive embedded processes. It saves device manufacturers time and money by combining high throughput and utilization of well established flip-chip and die attach processes with the permanent bonding process under well-controlled process parameters.
With these equipment installations, Datacon and EVG are now able to demonstrate and run the complete AC2W-process including metrology technologies within one lab, enabling efficient and comprehensive process development capabilities.
