Verigy And Test Insight Collaborate On Test Program
The new Verigy STIL Reader/Writer allows semiconductor manufacturers to improve their time-to-market by speeding the process for creating and debugging test programs. The STIL Reader/Writer is a result of Verigy's ongoing technology collaboration with Test Insight, a supplier of design to test software for digital integrated circuits (ICs).
"Building on Test Insight's tool technology, this new tool will help our customers in adopting STIL for accelerating their time-to-market," said Hans-Juergen Wagner, vice president and general manager, Semiconductor Test Solutions, Verigy.
"With this new and integrated capability, semiconductor manufacturers can take full advantage of the V93000 leading-edge platform technology in a standard-compliant tooling environment."
"Test Insight's extensive experience in providing design-for-test solutions, in conjunction with Verigy's tight cooperation, enabled us to provide this modular solution. Such modularity allows customers to select the pieces most suitable for their environment," said Meir Gellis, chief executive officer, Test Insight.
"The cooperation with Verigy gave us the opportunity to directly address customers' needs with a solution for bringing STIL test data to the tester and translating the results from the tester back to STIL."
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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