Tessera and NXP Sign new technology licensing agreement
NXP, formerly Philips Semiconductors, uses Tessera's advanced packaging technologies in many semiconductor devices, such as application specific standard products (ASSPs), digital signal processors (DSPs), application specific integrated circuits (ASICs), and microcontrollers. These devices are integrated into a wide range of products, including consumer, wireless, and communications electronics.
"Tessera's technologies have enabled NXP to provide a more vibrant and enhanced media experience to its consumers," said Christopher Pickett, executive vice president, technology licensing and general counsel. "We are delighted to have reached this agreement with one of the an innovative electronics companies, and we look forward to working with NXP as they continue to introduce next-generation products to their customers."
Under the terms of the agreement, NXP has licensed Tessera's semiconductor packaging technology for use across NXP's semiconductor device portfolio. The technology available to NXP covers a broad range of chip-scale and multi-chip package types, including integrated circuit devices packaged in "face-down," "face-up," "fold-over," "stacked," and "system-in-package" (SiP) formats, utilizing many different types of materials, including packages using either tape and laminate substrates. These package types are marketed by Tessera as MicroBG for face-down orientations, MicroBGA-F for face-up orientations, and MicroZ for multi-chip solutions. Tessera's intellectual property is utilized in many forms of advanced packaging, covering an extensive range of materials and assembly processes.
