CORWIL Technology completes SIP Module Design and Packaging.
CORWIL has teamed with substrate design and fabrication sources to provide customers with complete turnkey SIP Module design, substrate fabrication and packaging services. These additions complete the list of services necessary for CORWIL to provide full-service SIP and Module production. The renewed interest in modules has occurred due to assembly advances, such as wafer thinning, and die yield improvements, such as automated die inspection.
According to Phil Marcoux, CORWIL's SIP Module Business Development Manager, "the use of SIP Modules allows customers to bring complex new products to market rapidly and inexpensively so they can help validate the designs and functionality of their products."
Modules have been produced for many years. New technologies, such as, the ability to stack multiple die, to interconnect them with advanced wire bond shapes, smaller SMT components, and wafer level package techniques have increased the density and created higher value products.
