UMC delivers 65nm FPGAs to Xilinx
The new devices deliver a 65 percent logic capacity increase over previous generation FPGAs to enable higher gate count, with approximately 1.1 billion transistors. The chips, which feature triple gate oxide technology and 11 copper metal layers, have demonstrated excellent initial yields and are expected to be ready for full production in several months.
Jackson Hu, chairman and CEO of UMC, said, "UMC's 65nm technology has seen widespread acceptance from leading-edge manufacturers of cell phones, FPGA, graphics and broadband applications. Particularly noteworthy, is the number of new customers engaged at this technology node. This demonstrates the confidence that customers have in the competitiveness of our 65nm process. UMC's longstanding partnership with Xilinx continues to strengthen with each technology generation, with this latest product success representing yet another significant milestone for our two companies. We look forward in the coming months to bringing their newest products to full production."
Wim Roelandts, chairman, president and CEO of Xilinx, said, "Xilinx is currently ramping 65nm wafer starts at UMC. We are quite pleased with our progress — in fact, UMC's yields have exceeded our expectations for our most advanced products. We'll continue to leverage UMC's advanced 65nm technology for our upcoming product lines to strengthen our position in the FPGA industry."
