ATDF's advanced test mask aids Fujimi in Cu CMP processing
The supplier, Fujimi Corporation, found that the 454AZ enabled indepth performance studies of the effects of its chemical-mechanical polishing slurries on copper lines and tantalum-based structures. (Fujimi Corporation is the U.S. subsidiary of Fujimi Incorporated of Japan.)
Fujimi said its best performance was obtained using Fujimi slurry DCM-CX4 with ammonium persulfate oxidizer, a process that achieves extremely low topography during post-copper CMP. Less than 20 nm dishing on a 100 μm copper line was consistently obtained even after lengthy over-polishing.
"All of the tested types of copper low-k integration schemes, including those for porous low-k, yielded equivalent or better electrical performance than the previous generation of CMP processes," said Paul LeFevre, CMP Business Development Manager for Fujimi.
It is believed that this type of slurry could enable robust and high performance process for the next generation of CMP.
"It has the smallest feature sizes available on a CMP mask and is available for both 200 mm and 300 mm wafers," said Dave Anderson, ATDF general manager.
Fujimi utilized the 454AZ to compare its proprietary platform with a best-known method (BKM) approach.
