News Article
Canadian Nano Fab selects SUSS Wafer Bonder
SUSS MicroTec has announced that the University of Alberta’s NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities.
The NanoFab is an open access micro and nano fabrication facility which is currently being used by over 130 research groups from the University of Alberta, other Canadian Universities and industry. The SUSS ELAN CB6L manual bonder will be used in nanotechnology research, pressure sensors for the oil industry, and RF MEMS switches for wireless applications.
Westra has over 20 years experience in MEMS fabrication, thin films, and microfabrication in both industry and academia. “We are pleased to invest in the SUSS bonder as part of our strategy to provide the latest MEMS process technologies to our research partners,” says Dr. Ken Westra, Director of the NanoFab.
“We are pleased that the ELAN bonder has been chosen to support process advances at R&D level. Researchers using the NanoFab will benefit from the ability to easily transfer technology developed on the ELAN bonder to any SUSS production wafer bonding system,” says Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA.
