Austriamicrosystems expands multi project wafer service
Austriamicrosystems has unveiled an extensive prototyping schedule for High-Voltage CMOS, High-Voltage CMOS embedded Flash, SiGe-BiCMOS and CMOS specialty processes. Austriamicrosystems ASIC prototyping service combines several designs from different customers onto one wafer. This approach, known as Multi-Project Wafer (MPW) or shuttle run, allows cost sharing for wafer and masks among a number of different customers. Focused on its advanced 0.35?m High-Voltage CMOS, High-Voltage CMOS embedded Flash and SiGe-BiCMOS processes, austriamicrosystems can offer a cost-efficient and fast prototyping service on its specialty processes to foundry customers. Long lasting co-operations with organizations like CMP-TIMA, Europractice, Fraunhofer IIS and MOSIS enable austriamicrosystems to provide more than 150 MPW start dates in 2007.
Austriamicrosystems' foundry customers can deliver their completed GDSII-data at specific dates and receive untested packaged samples or dies within a short lead-time of typically 8 weeks for CMOS processes and 10 weeks for High-Voltage CMOS, SiGe-BiCMOS and embedded Flash processes. All MPW-Runs will be produced at austriamicrosystems' state-of-the-art 8 inch wafer fab at its headquarters in Austria.
