News Article
New state-of-the-art wafer bumping and backend processing facility in Malaysia
Pac Tech has begun working on its new 53,512 square foot wafer bumping facility in Penang, Malaysia.
Pac Tech has begun working on its new 53,512 square foot wafer bumping facility in Penang, Malaysia. The production floor space will occupy up to 40,000 square feet including cleanroom facilities with latest generation of equipment. This facility, when completed in June of 2007, will meet semiconductor market requirements for low-cost wafer-bumping and backend processing.
