Spansion Selects KLA-Tencor’s E-Beam Inspection Technology
KLA-Tencor, Inc. announced that Spansion, Inc. has selected its eS32 electron beam inspection system for multiple applications in 65nm MirrorBit Flash memory production and 45nm development. Spansion's selection of the eS32 was based on the system's ability to enhance yield by capturing and identifying critical systematic defects at Spansion's Submicron Development Centre (SDC).
"Rapid yield ramp on new technologies is critical for competitiveness in the Flash memory market, and KLA-Tencor's eS32 system has combined defect sensitivity with high-productivity algorithms to play an important role in our yield-enhancement program," said James Pak, director of engineering at Spansion SDC. "We are integrating this tool into our inspection strategy as we expand its use to our production fabs. With the eS32 system, KLA-Tencor has demonstrated the effectiveness of in-line e-beam inspection technology in Flash memory manufacturing."
KLA-Tencor's e-beam inspection technology is growing as the industry ramps 65nm production and continues with 45nm development. eS32 systems have been shipped to both memory and logic customers in all regions worldwide since its introduction in early 2006, including repeat orders for multiple systems.
"Our e-beam inspection technology offers customers a combination of enhanced physical defect capture, as well as sensitivity for finding critical voltage-contrast-type defects - electrically active defects that can impact device performance." said Keith Wells, vice president and general manager of KLA-Tencor's e-beam inspection division.
