NXP and TSMC strengthen R&D and manufacturing partnership
NXP Semiconductor, founded by Philips, and Taiwan Semiconductor Manufacturing Company Limited (TSMC) have announced they will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as manufacturing partnership.
"We've chosen to strengthen our cooperation with TSMC, in the area of advanced CMOS development," stated Frans van Houten, NXP President and Chief Executive Officer. "This move will enable NXP to concentrate more on creating innovative, differentiating process options, such as embedded non-volatile technology in 45nm for our System-on-Chip products, while building on the process platform from TSMC."
"With our strengths in technology, manufacturing, and customer partnership, TSMC has become a strategic partner for many global customers with whom we have forged a strong relationship with in the semiconductor industry. This agreement with NXP Semiconductors represents an extension of the long-term, strategic and fruitful alliance between the two companies. The synergy between these two global technology companies will achieve new milestones in the foreseeable future," stated Dr. Rick Tsai, president and Chief Executive Officer of TSMC.
The strengthened global R&D cooperation will be built upon the existing NXP Research organization at the IMEC facilities in Leuven, Belgium, and TSMC corporate R&D in Hsinchu, Taiwan. It leverages the R&D talent and infrastructures of both companies in the area of IP, design, modelling, materials, and process technologies. NXP has a fruitful cooperation with IMEC, in the field of micro- and nanoelectronics and nanotechnology. TSMC is also a core member of IMEC. The joint research effort will enable NXP to do proprietary development based on TSMC platform technology. This strengthened cooperation will also allow TSMC to further expand its research activities in Europe.
