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Agreement signed to commercialize image sensors for wafer-level CSP
Oki Electric Industry Co., Ltd. and ZyCube Co., Ltd. have announced an agreement to cooperate in commercializing ZyCSP, an image sensor LSI with buried interconnects (also called TSV (Through Silicon Via)) that is equivalent in size to a wafer level chip size package(CSP).
Oki Electric Industry Co., Ltd. and ZyCube Co., Ltd. have announced an agreement to cooperate in commercializing ZyCSP, an image sensor LSI with buried interconnects (also called TSV (Through Silicon Via)) that is equivalent in size to a wafer level chip size package(CSP). "Consumers desire information devices to be smaller, higher density with multi-functions as seen in camera-equipped mobile phones and digital cameras," said Manabu Bonkohara, CEO of ZyCube. "Our strategy is to focus on the image sensor market for these devices for now, and eventually expand to the 3D compound product market with digital signal processing function. With our ZyCSP technology."OKI, holds advanced wafer level CSP (W-CSP) technology achieving packages equivalent to chip sizes. Through the collaboration, OKI will work to achieve smaller and thinner passive and active components taking advantage of its W-CSP and semiconductor processing technologies. It will also be possible for OKI to apply the new production technology for making LSIs having buried interconnections to its own products.The two companies will jointly develop and manufacture packages for C-MOS and CCD sensors with buried interconnects. OKI will build a combination 8-inch/12-inch development and production line for ZyCSP at its Hachioji facility in Japan. According to the business scale, OKI will expand the production line."In addition to our current 6 and 8-inch W-CSP assembly foundry business, we will actively provide small and high-performance packaging solutions by expanding in to 12 inch with ZyCube," said Takaki Yamada, President of Silicon Micro Device Company at Oki Electric Industry. "We will deploy business in the growing information device market with ZyCSP products, and remain committed to creating new applications in the ‘personal and mobile' markets, and provide smaller, higher performance and lower power consumption products for mobile terminals."
