Agreement made for sale of Hiroshima Elpida's 200mm wafer processing equipment
Elpida Memory, Inc. (Elpida) has announced that it has reached a basic agreement with Semiconductor Manufacturing International Corporation (SMIC) and Cension Semiconductor Manufacturing Corporation (Cension) concerning the sale of 200mm wafer processing equipment to Cension. The equipment transferred to Cension will be operated by SMIC.
Elpida has concluded that it is important for Hiroshima Elpida Memory, Inc. (Hiroshima Elpida) to sell its 200mm wafer processing equipment in order to devote Elpida's resources to quickly achieving a 300mm line that uses advanced production processes. Thus, as part of this increase in 300mm line manufacturing capabilities, it has decided to transfer Hiroshima Elpida's 200mm equipment to Cension.
Elpida expects that the Hiroshima Elpida's 200mm equipment will be used more efficiently by SMIC, who have the intention to continue providing support to customers who have placed orders for production of 200mm wafer line products.
