TAZMO and Silecs expand collaboration on wafer processing tools
TAZMO Co., Ltd. and Silecs, Inc. announced that the companies have completed the installation of TAZMO's Spin Coating System at Silecs' new electronic materials production and demonstration facilities in Espoo, Finland. The spin coater will be used to run wafer demos for semiconductor customers of both TAZMO and Silecs. In addition to providing automatic, high uniformity spin coating of dielectrics, the track has open and closed cup modules and provides the ability to cure dielectric films in a variety of atmospheres including high temperature and UV-curing.
"The placement of our spin coater in Silecs' facilities provides our European customers a quick turn-around for wafer demos," said Toshio Ikeda, Managing Director of TAZMO. "Silecs' new facility in Espoo is an excellent place to locate our track, in a high quality clean room production environment supported by experienced staff."
"Our collaboration with TAZMO, and the placement of this high performance coater in our facilities, adds to our capabilities to support our semiconductor customers worldwide," said Fred McNeil, Vice President of Sales for Silecs."
