Freescale redistributed chip packaging technology moves toward volume production
Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing. In addition, the RCP technology hit a key milestone as it passed commercial industry specifications.
Freescale announced the RCP technology in July 2006. RCP integrates semiconductor packaging as a functional part of the die and system solution. The technology is applicable to 3G mobile phones and a broad range of consumer, industrial and networking devices that can benefit from the consolidation of electronic components into a single, miniaturized system.
"We look forward to proliferating this technology across our product portfolio." said Sumit Sadana, senior vice president of Strategy and Business Development and chief technology officer for Freescale.
