TSMC and NEXX Systems collaborate in cu plating development
NEXX Systems has announced that it has entered into an ongoing joint development program (JDP) with Taiwan Semiconductor Manufacturing Company. (TSMC) of Hsinchu, Taiwan. The JDP represents a collaborative effort to assess, develop, optimize, manufacture, and/or market electrodeposition processes using the Stratus system, including through silicon vias (TSV), wafer level chip scale packaging, and redistribution layers. In support of this effort, NEXX will both deliver a Stratus 300 automated electrodeposition system to TSMC's Fab 7 in Hsinchu and provide leading process development experts to carry out the development work in conjunction with TSMC's local experts.
"The Stratus will provide TSMC a proven means of filling TSVs that is both cost effective and high yielding," stated Arthur Keigler, vice president of technology of NEXX Systems. "NEXX is pleased to participate in TSMC's program for creating chip stacking technologies that enable high performance compact devices."
The managers of the bumping department at TSMC added, "We are pleased to be working with NEXX Systems to build our capabilities for TSVs, wafer level chip scale packaging, especially in low cost solutions. We recognize the low cost benefits with high performance the Stratus system offers for these applications."