News Article
SUSS and STS Launch MEMS Technology Roadshow
SUSS MicroTec and Surface Technology Systems, two MEMS manufacturing solutions providers, have announced a based roadshow called "MEMS Technology: Embracing the Future,"
SUSS MicroTec and Surface Technology Systems, two MEMS manufacturing solutions providers, have announced a based roadshow called "MEMS Technology: Embracing the Future,"
The programme will include presentations on the latest critical manufacturing processes in MEMS today. Talks will cover high aspect ratio lithography and plasma etching, wafer bonding, dry release processing and wafer level test. In addition, speakers will discuss the key manufacturing issues critical for advanced MEMS device fabrication today. SUSS and STS have invited representatives from Primaxx, Inc. and XACTIX, Inc. to join the roadshow, creating a unique opportunity to listen to industry experts cover most of the key MEMS technologies used today.
John Saunders, CEO of STS explained "We are very excited to have the opportunity to co-host this roadshow and share our experience and vision for the future of MEMS manufacturing. Like SUSS, we are committed to advancing technology and enabling customers to manage the complexities of MEMS chip fabrication today."
"We work every day with MEMS customers who are pushing the technology envelope," said Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA. "By coming together with companies like STS who do the same, we are in a unique position to help the industry develop strategies for handling rapidly changing technology and MEMS manufacturing challenges."
The programme will include presentations on the latest critical manufacturing processes in MEMS today. Talks will cover high aspect ratio lithography and plasma etching, wafer bonding, dry release processing and wafer level test. In addition, speakers will discuss the key manufacturing issues critical for advanced MEMS device fabrication today. SUSS and STS have invited representatives from Primaxx, Inc. and XACTIX, Inc. to join the roadshow, creating a unique opportunity to listen to industry experts cover most of the key MEMS technologies used today.
John Saunders, CEO of STS explained "We are very excited to have the opportunity to co-host this roadshow and share our experience and vision for the future of MEMS manufacturing. Like SUSS, we are committed to advancing technology and enabling customers to manage the complexities of MEMS chip fabrication today."
"We work every day with MEMS customers who are pushing the technology envelope," said Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA. "By coming together with companies like STS who do the same, we are in a unique position to help the industry develop strategies for handling rapidly changing technology and MEMS manufacturing challenges."
