News Article
MEMS development centre to be equipped with new bonding system
SUSS MicroTec announced that Infotonics has selected the SUSS ABC200 wafer bonding cluster tool and FC150 device bonder as strategic investments in their MEMS packaging lab.
SUSS MicroTec announced that Infotonics has selected the SUSS ABC200 wafer bonding cluster tool and FC150 device bonder as strategic investments in their MEMS packaging lab.
"The ABC200 and FC150 will be key components in our suite of core technologies for MEMS fabrication and packaging," said Dr. Nancy Stoffel of the Infotonics Technology Centre.
"The ABC200 will allow automated precision alignment, cleaning, bonding and inspection all in one system".
"We are delighted to partner with Infotonics in their important work," said Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, USA.
"The ABC200 and FC150 will be key components in our suite of core technologies for MEMS fabrication and packaging," said Dr. Nancy Stoffel of the Infotonics Technology Centre.
"The ABC200 will allow automated precision alignment, cleaning, bonding and inspection all in one system".
"We are delighted to partner with Infotonics in their important work," said Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, USA.
