News Article
IC Interconnect and JCAP China form intercontinental alliance
IC Interconnect (ICI has announced an agreement with Jiangyin Changdian Advanced Packaging (JCAP)
IC Interconnect (ICI has announced an agreement with Jiangyin Changdian Advanced Packaging (JCAP. The agreement brings ICI's electroless Ni UBM processing technology to Asia, and JCAP's multitude of bumping technologies to North America.
"This new relationship is truly beneficial to both IC Interconnect and JCAP," says Curt Erickson, president of IC Interconnect. "We are excited to come together to offer our customers around the world more choices and flexibility for their wafer bumping needs."
The agreement establishes ICI/jcap International, a wholly-owned subsidiary of IC Interconnect. It makes available a facility where IC Interconnect can install and operate its electroless Ni UBM process in China.
