News Article
TSMC schedules 45nm production for September
Taiwan Semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007.
Taiwan Semiconductor Manufacturing Company has announced that it would complete 45nm technology qualification and enter production as early as September 2007. The new 45nm process combines advanced 193nm immersion photolithography, performance-enhancing silicon strains, and extreme low-k (ELK) inter-metal dielectric material.TSMC's 45nm low power process (LP) provides twice the density of 65nm with significantly lower power and manufacturing cost per die. End products are expected to achieve 40 percent greater functionality or 40 percent smaller die size, with reduced power consumption. These factors are particularly crucial for system on chip (SoC) designs with an ever-smaller footprint for cell phones, portable media players, PDAs and other handheld devices."Customers expect both performance and reliability from TSMC, a fact that has guided the development of our 45nm process every step of the way," said Dr. Rick Tsai, president and CEO of TSMC. "With our 45nm solution ready production will start in September."
