News Article
Joint effort for design-aware mask inspection aims for higher 45nm device yield
KLA-Tencor and Clear Shape Technologies have announced that they are collaborating on DFM (design for manufacturability) solutions enabling "design-aware" photomask inspection at 45nm and below.
KLA-Tencor and Clear Shape Technologies have announced that they are collaborating on DFM (design for manufacturability) solutions enabling "design-aware" photomask inspection at 45nm and below. The collaboration involves using KLA-Tencor's new Terascan HR photomask inspection system, introduced this year, and Clear Shape's Variability Platform products, InShape and OutPerform. The two companies expect this collaboration to enable customers to achieve improved device yield and, ultimately, faster production ramp for the most advanced designs.
"Having the ability to utilise critical design intent models in our photomask inspection system should allow our customers to more quickly ramp production, with the potential to then increase yield ramp cycle time in 45nm and below manufacturing," said Harold Lehon, vice president and general manager of KLA-Tencor's Reticle and Photomask Inspection Division.
"Clear Shape's electrical DFM solution, which is based on fast and accurate silicon contour prediction models, provides additional enabling capabilities for our latest generation of photomask inspection systems."
At 45nm and below, chipmakers risk an increase in systematic yield loss resulting from defects without obvious pattern transfer errors but which cause device electrical performance and/or functional problems.
By understanding a photomask defect's effect on final silicon electrical performance, a higher correlation can be established between the defect and final wafer yield, significantly improving yield predictability. Clear Shape's electrical DFM technology enables a strong ‘electrical design intent' relationship between design, mask manufacturing and wafer processing, so that parametric transistor gate and interconnect yield can potentially be better controlled in the design flow.
"We are proud to be working with KLA-Tencor to advance the tremendous potential of design-aware manufacturing," said Atul Sharan, President and CEO of Clear Shape.
"This collaboration with KLA Tencor is designed to give our customers increased ability to accelerate device yield by bringing electrical design intent information directly into photomask inspection thus bridging the gap between design and manufacturing."
"Having the ability to utilise critical design intent models in our photomask inspection system should allow our customers to more quickly ramp production, with the potential to then increase yield ramp cycle time in 45nm and below manufacturing," said Harold Lehon, vice president and general manager of KLA-Tencor's Reticle and Photomask Inspection Division.
"Clear Shape's electrical DFM solution, which is based on fast and accurate silicon contour prediction models, provides additional enabling capabilities for our latest generation of photomask inspection systems."
At 45nm and below, chipmakers risk an increase in systematic yield loss resulting from defects without obvious pattern transfer errors but which cause device electrical performance and/or functional problems.
By understanding a photomask defect's effect on final silicon electrical performance, a higher correlation can be established between the defect and final wafer yield, significantly improving yield predictability. Clear Shape's electrical DFM technology enables a strong ‘electrical design intent' relationship between design, mask manufacturing and wafer processing, so that parametric transistor gate and interconnect yield can potentially be better controlled in the design flow.
"We are proud to be working with KLA-Tencor to advance the tremendous potential of design-aware manufacturing," said Atul Sharan, President and CEO of Clear Shape.
"This collaboration with KLA Tencor is designed to give our customers increased ability to accelerate device yield by bringing electrical design intent information directly into photomask inspection thus bridging the gap between design and manufacturing."
