News Article
SUSS MicroTec announces new R&D placement bonding system
SUSS MicroTec has unveiled the KADETT, a new High Accuracy Placement and Bonding System especially configured for R&D laboratories, universities and pre-production environments.
SUSS MicroTec has unveiled the KADETT, a new High Accuracy Placement and Bonding System especially configured for R&D laboratories, universities and pre-production environments.
The new SUSS KADETT Semi-Automatic Device Bonder is a flexible and open platform for accurate assembly and bonding of devices on a large variety of substrates. The machine performs accurate Pick and Place functions. A wide range of bonding processes including In-Situ Reflow, Thermo-Compression, Thermo-Sonic and Adhesive Bonding are available for forces up to 75N.
The KADETT, originally developed by the Paul Scherrer Institute, has been proven in the field for bonding Ionizing Radiation Detectors and it is also well suited for Advanced Packaging, micro-optics or MEMS assembly.
Accurate alignment is automatically achieved by a vision system which uses two independent high resolution video microscopes (chip and substrate) with a high resolution (0.1µm) XY alignment stage.
The flexible architecture of the SUSS KADETT enables the integration of many processing modules such as a UV glue curing system, Ultrasonic bonding head and many others. “Its easy and quick changeover between the various process configurations is of primary interest for research environments where adaptability and multi-user compatibility is essential“, said Gilbert Lecarpentier, International Product Manager at SUSS MicroTec Device Bonder Division.
