News Article
Wafer-level packaging requirements create market opportunities
Semiconductor metrology equipment manufacturer Jordan Valley Semiconductors has announced they have sold, installed and qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications.
Semiconductor metrology equipment manufacturer Jordan Valley Semiconductors has announced they have sold, installed and qualified multiple units of their JVX 6200 system to leading memory manufacturers for wafer-level packaging applications. The explosive growth in high density, high pin count devices that necessitate the more sophisticated types of packaging are now requiring advanced metrology.Wafer-level packaging advantages:As consumer electronics continue to shrink in size and increase in features and functions, cell phones, laptops, cameras and other handheld devices are requiring new chip packages. Wafer-level packaging (WLP) offers the smallest package available (often the size of the actual chip), the lowest cost for electrical test and burn-in, and enhances device performance with its minimum length interconnects."This is an emerging market for our tool and a shift in how back-end metrology is accomplished," commented Sean Jameson, VP of sales and marketing for Jordan Valley. "Typically, our metrology tools are primarily being used in fabs for in-line measurement of product wafers. Now, the new requirements for lead-free solder and wafer-level packaging have forced a movement to advanced small spot X-ray metrology. Traditional metrology is not effective with these newer, tighter pitch wafer-level packages and the measurements they require."These advanced x-ray metrology systems were sold during the third and fourth quarters of 2006 and have since been installed and qualified in fabs in the United States and Asia Pacific.
