+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
News Article

Equipment and materials provider joins EMC-3D international consortium

News
Brewer Science has joined the EMC-3D international consortium of equipment providers, materials companies and researchers to address complex integration of Thru-Silicon-Via (TSV) 3D chip interconnects.
Brewer Science has joined the EMC-3D international consortium of equipment providers, materials companies and researchers to address complex integration of Thru-Silicon-Via (TSV) 3D chip interconnects.The consortium addresses the technical and economic issues of creating 3-D interconnects using TSV technology for chip stacking and advanced MEMS/sensors packaging. Through collaboration with research partners, the consortium will develop processes for creating micro-vias between 5 and 30 µm on thinned 50-µm 200- and 300-mm wafers using both via-first and via-last techniques. The primary goals of the consortium are to create a robust process flow at a cost of less than $200USD per wafer.
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: