News Article
Equipment and materials provider joins EMC-3D international consortium
Brewer Science has joined the EMC-3D international consortium of equipment providers, materials companies and researchers to address complex integration of Thru-Silicon-Via (TSV) 3D chip interconnects.
Brewer Science has joined the EMC-3D international consortium of equipment providers, materials companies and researchers to address complex integration of Thru-Silicon-Via (TSV) 3D chip interconnects.The consortium addresses the technical and economic issues of creating 3-D interconnects using TSV technology for chip stacking and advanced MEMS/sensors packaging. Through collaboration with research partners, the consortium will develop processes for creating micro-vias between 5 and 30 µm on thinned 50-µm 200- and 300-mm wafers using both via-first and via-last techniques. The primary goals of the consortium are to create a robust process flow at a cost of less than $200USD per wafer.