Joint effort will expand technology applicability at 40nm and below
Spansion Inc. and Taiwan Semiconductor Manufacturing Company have announced the signing of a definitive agreement to begin joint development of variations of MirrorBit technology at 40nm and below.
Under the agreement, Spansion will use the jointly developed variations of MirrorBit technology to expand its applicability in new areas, while TSMC will make the processes production-proven and plans to bring Spansion's advanced Flash memory technologies to volume. Specific terms of the agreement were not disclosed.
"MirrorBit is a logic-based platform technology that allows massive amounts of integration," said Bertrand Cambou, president and chief executive officer of Spansion. "TSMC has remarkable process technology development expertise and we look forward to working with them to leverage MirrorBit technology into new areas."
Spansion and TSMC have a prior agreement for 110nm and 90nm MirrorBit technology. TSMC has been producing Spansion Flash memory wafers at 110nm since the second quarter of 2006. The production ramp for 90nm MirrorBit technology is expected to be built on 300mm wafers in the middle of 2007.
"Collaborating with Spansion expands our technology portfolio and increases our participation in the fast-growing Flash memory business," said Rick Tsai, president and chief executive officer of TSMC.
