New 1.05mm MEMS microphone with Low profile and high heat developed
Matsushita Electronic Industrial Co. has developed a slim MEMS microphone suitable for portable electronic appliances typifying mobile phones. Sample shipment will start at the end of May 2007.
The new MEMS microphone is constructed from an acoustic transducer (MEMS chip) made with MEMS technology and a CMOS amplifier, realising low profile, at the same time, high heat resistance which enables Pb-free reflow solder mounting.
The new MEMS microphone contributes to reducing the height of portable electronic appliances, as well as reducing the mounting cost in their production process. It also contributes to realising environment-conscious appliances by high heat resistance of 260 degree C which is required by Pb-free automatic reflow solder for print circuit board surface mount.