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News Article

Wafer handling system selected by analytical tool company with Taiwan to follow

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Chad Industries Inc has announced that it has been qualified by Applied Precision as their recommended EFEM (Equipment Front-End Module) supplier for their waferWoRx300 probing process analysis system.
Chad Industries Inc has announced that it has been qualified by Applied Precision as their recommended EFEM (Equipment Front-End Module) supplier for their waferWoRx300 probing process analysis system."We selected Chad Industries to supply the wafer handling automation for the waferWoRx300 tool because of several factors including Chad's superior product design, excellent project management and outstanding customer support," said Darren James, Applied Precision Product Line Manager. "Chad not only worked closely with our team to achieve a seamless integration of the EFEM and the waferWoRx300 tool, but also with our customer to ensure a successful installation."Applied Precision qualified Chad's WaferMate300 series of wafer handling systems by working closely with Chad's experienced engineering team to optimise the hardware integration and software communications between the two platforms. With this accomplished, the WaferMate system was shipped directly from Chad to Applied Precision's customer in the Northwestern America and integrated with the waferWoRx300 tool on site seamlessly. The next integration of these systems is scheduled for June at a major fab in Taiwan."We are very pleased that Applied Precision has selected Chad as the vendor of choice for wafer handling automation. This design win adds to our portfolio of tool companies that have chosen to integrate WaferMate systems," said Scott Klimczak, president of Chad Industries. "Over the last year, we have refined the WaferMate product line. We expect to increase our market share in the front-end OEM market by leveraging the advantages of the WaferMate. We believe that our ability to customise the WaferMate platform to handle a variety of non-standard substrates, including thin, warped, glass and grooved wafers, enables us to offer our customers wafer handling solutions that fit their current and future applications.
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