News Article
New high performance custom chip to commercialise eDRAM in SOI technology
IBM has announced new semiconductor products that leverage several IBM-generated chip technology breakthroughs.
IBM has announced new semiconductor products that leverage several IBM-generated chip technology breakthroughs. One of these offerings, IBM's new Cu-45 High Performance Custom Chip (ASIC), represents the commercial introduction of Silicon On Insulator (SOI) technology -- historically only used for high performance microprocessors -- into communications, consumer and other major market segments. In addition, the Cu-45HP ASIC offering is the first commercial use of a new generation of embedded dynamic random access memory (eDRAM) implemented in Silicon-on-Insulator (SOI) technology. ASIC's are specialised semiconductors designed to allow clients to differentiate their products in industries that include aerospace, defence, storage, consumer electronics, networking devices and other image-intensive, multi-media applications. A chip designed solely to run in a cell phone is an example of an ASIC. IBM's new 45nm eDRAM technology implemented in SOI can dramatically improve on-processor memory performance in about one-third the space with one-fifth the standby power of conventional SRAM (static random access memory). "The market can now take advantage of chip products that harness IBM's position in research and innovation," said Tom Reeves, vice president, IBM GES Semiconductors and Services. "From the first ASIC SOI chip at 45nm to the use of the new eDRAM and chip integration technologies, the advances that are part of these new semiconductor offerings enable flexible, cost-effective products that enhance the value of customised IBM semiconductor solutions."