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Partnership will integrate hybrid dicing tool with laser micro jet technology

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In a move that will greatly broaden global access to its water jet-guided laser technology, Synova has revealed it has entered into a partnership with Disco Hi-Tec Europe. ;;
In a move that will greatly broaden global access to its water jet-guided laser technology, Synova has revealed it has entered into a partnership with Disco Hi-Tec Europe. Under terms of the alliance, the two companies will work jointly to combine Synova's patented Laser MicroJet technology with Disco's latest-generation blade-saw dicing systems to develop a hybrid dicing tool for advanced-dicing applications. The resulting solution will enable semiconductor manufacturers to meet their dual need for higher throughput and minimal damage on silicon wafers and the emerging genre of advanced material wafers of any thickness. Company officials report that the first tools are slated for introduction in late 2007. "This partnership represents an important milestone for Synova—and for the packaging industry," said Synova's chief executive officer, Dr. Bernold Richerzhagen. "Now, driven by market demand, we've been afforded the opportunity to partner with Disco to develop a new breed of dicing system that incorporates the utmost capabilities of both companies. We look forward to working together to speed the commercialisation of this system." Karl Heinz Priewasser, Executive Vice President of Disco Hi-Tec Europe, stated, "Synova's water jet- guided approach offers a number of valuable benefits for a variety of processes. We believe that the fusion of Synova's technology with our products will result in a solution that allows our customers to take full advantage of the best both companies have to offer." Limited strictly to joint development work with Disco's blade saw, the agreement will enable both companies to pursue collaborative R&D efforts to hasten successful integration of Synova's core technology into Disco's systems. Both companies will contribute to the manufacturing of the resulting hybrid tool.
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