Info
Info
News Article

Lithography

News
Hynix joins IMEC in (sub-)32nm CMOS research
Research and development platform recently united IMEC and Hynix Semiconductor. Joining forces in a collaborative effort the companies will explore immersion and EUV lithography challenges within IMEC’s non-volatile memory program.

Hynix joins IMEC's (sub-)32nm CMOS research platform


Hynix Semiconductor Inc (Hynix has entered into a strategic partnership with IMEC, to perform research and development for the (sub)-32nm memory process generations.


As part of the agreement, Hynix will collaborate within IMEC's advanced lithography program addressing both immersion and EUV lithography challenges and within IMEC's nonvolatile memory program. The latter program has gained significantly increased momentum in the past year by expanding its floating gate and nitride memory activity lines into advanced material research, including exploration of advanced high-k dielectrics. From June 2007 onwards, a team of researchers of Hynix will reside at IMEC to closely collaborate with IMEC's researchers in the above mentioned areas. In this way, they will build up fundamental understanding and develop robust solutions for the 32nm and beyond DRAM and Flash memory process generations.


With this agreement, the top five memory suppliers including Hynix, Elpida, Micron, Qimonda and Samsung, collaborate within IMEC's global research platform to scale CMOS to 32nm node and beyond. The platform also unites multinational logic IDMs and foundries, including Infineon, Intel, NXP, Panasonic, STMicroelectronics, Texas Instruments and TSMC. With leading companies of the two semiconductor market segments jointly collaborating in the platform, a selective interaction and cross-fertilisation is established which enhances process R&D to the 32nm node and beyond answering the needs of the whole semiconductor market.


“With facing various challenges in developing next generation technologies, difficulty and risk have continually increased,” said Dr. Park Sung-Wook, Executive Vice President and head of R&D Division, Hynix Semiconductor. “By joining IMEC and collaborating with industry-leading partners, we expect to lessen the risk for developing leadingedge, cost-effective technology and contribute to the growth of the semiconductor industry.”


“We are excited that Hynix has joined our research platform. Their valuable know-how in memory scaling will be an important asset for our global research platform,” said Prof. Gilbert Declerck, President and CEO of IMEC, (pictured above). “The fact that the world's top five memory suppliers and five leading logic manufactures and foundries joined our research platform proves we have been successful in adapting our programs to the needs of all semiconductor players. The programs run in a balanced way with good interaction and cross fertilisation between logic and memory companies.”



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
ASML Reports €14.0 Billion Net Sales
ITRI And DuPont Inaugurate Semiconductor Materials Lab
EV Group Establishes State-of-the-art Customer Training Facility
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Will Future Soldiers Be Made Of Semiconductor?
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Changes In The Management Board Of 3D-Micromac AG
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
TEL Introduces Episode UL As The Next Generation Etch Platform
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Onto Innovation Announces New Inspection Platform
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
DISCO's Completion Of New Building At Nagano Works Chino Plant
Panasonic Microelectronics Web Seminar
New Plant To Manufacture Graphene Electronics
AP&S Expands Management At Beginning Of 2021
SUSS MicroTec Opens New Production Facility In Taiwan
Cadence Announces $5M Endowment To Advance Research
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event