News Article
UltraThin wafer handling solution introduced for market integration
EV Group (EVG) and Brewer Science, Inc. have announce that they have introduced a new system and offer new capabilities and yield performance for UltraThin Wafer Processing.
EV Group (EVG) and Brewer Science, Inc. have announce that they have introduced a new system and offer new capabilities and yield performance for UltraThin Wafer Processing. Semiconductor manufacturers continue to push for increasingly thinner wafers and devices. This push is driven by the need for innovative packaging options such as 3-D packaging and by demands for higher device performance and lower power consumption. Until recently, no clearly superior manufacturing process had emerged for handling UltraThin wafers. Brewer Science and EVG have collaborated to create a new temporary wafer bonding technology to provide a novel solution for processing UltraThin wafers. This technology solution is comprised of Brewer Science's WaferBOND HT series of materials and EV Group's bonding and debonding equipment platforms(EVG850TBDB) and the development of a solution for safely and reliably processing sub-100 micron thinned wafers. This jointly developed technology performs temporary bonding of original thickness device wafers onto rigid carrier wafers. The application of the WaferBOND HT materials via a spin-coating, baking and subsequent bonding process is performed on EVG850TB system. Highest yield and manufacturing performance through thinning and further backside processing steps are maintained with the created waferstack. In addition, the WaferBOND HT material enables utilisation of, unknown high- temperature processing steps and high-vacuum compatibility. The commercialised system is the result of a multiyear partnership between Brewer Science and EV Group.
