News Article
Partnership will develop DRIE for advanced microelectronic packaging applications
CEA/Leti-Minatec and Alcatel Micro Machining Systems have announced their joint collaboration for the development of industrial process capability in DRIE and LTPECVD for 3D interconnect applications.
CEA/Leti-Minatec and Alcatel Micro Machining Systems have announced their joint collaboration for the development of industrial process capability in DRIE and LTPECVD for 3D interconnect applications.Advanced packaging technologies and chip stacking techniques play an increasing role in the evolution of microelectronics and microsystems. CEA Leti-Minatec is currently well-positioned in 3D integration and intends to extend capabilities to include thru-wafer micro vias to allow dense interconnect on both sides of chips. Considering the importance of deep anisotropic etching of silicon and via isolation to the success of the technology, CEA-Léti Minatec will accelerate development by joining efforts with Alcatel Micro Machining Systems. The Joint Development Agreement signed in July will leverages capabilities made possible by the installation of two new 200mm Alcatel machines for DRIE of silicon and LTPECVD of low temperature oxide isolation. The two year program will allow the partners to develop and demonstrate a suite of turn-key solutions for integration in advanced electronic systems.
