New Coating Cluster Tool For Wafer Bumping And LED Manufacturing Applications
SUSS MicroTec has announced the launch of its new Gamma XPress, an advanced coating cluster targeting wafer bumping as well as LED manufacturing applications.
SUSS MicroTec has announced the launch of its new Gamma XPress, an advanced coating cluster targeting wafer bumping as well as LED manufacturing applications. The Gamma XPress coating cluster is offered in different configurations designed for specific applications. These include gold bump coating, under bump metal or redistribution coating, high volume LED coating as well as standard and dry film developing. The market-oriented concept of the Gamma XPress combines an efficient and flexible production setup with short lead times, thus helping to keep the customers' time to market to a minimum. "The Gamma XPress is the perfect match for today's most demanding performance requirements in the field of wafer bumping and high volume LED manufacturing", says Rolf Wolf, General Manager, SUSS MicroTec's Lithography Division. "The coat and develop cluster addresses the needs for flexible, clean, and reliable coating processes."