News Article
First 300 mm etch system shipped for 3-D IC etch applications
Lam Research Corporation has announced it has shipped its first 300 mm 2300 Syndion etch system, designed for 3-D IC through-silicon via (TSV) etch applications.
Lam Research Corporation has announced it has shipped its first 300 mm 2300 Syndion etch system, designed for 3-D IC through-silicon via (TSV) etch applications. Additional 300 mm shipments are expected this quarter. Production release of the 2300 Syndion is planned during the first half of 2008. "We believe we are the first supplier to ship a 300 mm system for TSV etch applications," said Lam Research's Jackie Seto, managing director, Software, MEMS, and 3-D IC Products, "and, by leveraging our extensive 300 mm and MEMS deep silicon etch production experience, we are establishing our benchmarks for these challenging etch applications." "Our customers are still in the early stages of development," said Seto, "so process flexibility is essential. The Syndion system has demonstrated etch capability for a wide range of integration schemes, with excellent uniformity across 300 mm wafers. The system has also etched vias ranging from 2 to 100 microns wide with depths of 20 microns to greater than 400 microns deep, while meeting our customers' exacting profile requirements."
