MEMS technology roadshow set to tours Europe
SUSS MicroTec and Surface Technology Systems have announced that the successful 'MEMS Roadshow', which toured 5 cities in the US earlier this year, will now travel to Europe.
'MEMS Technology: Embracing the Future' will include presentations on the latest critical manufacturing processes in MEMS today. Talks will cover high aspect ratio lithography and plasma etching, wafer bonding, dry release processing and wafer level test. In addition, speakers will discuss the key manufacturing issues critical for advanced MEMS device fabrication today.
SUSS and STS have invited representatives from Primaxx, Inc. and XACTIX, Inc. to join the roadshow, creating an opportunity to listen to industry experts cover most of the key MEMS technologies used today.
John Saunders, CEO of STS explained, "We are very excited to have the opportunity to co-host this roadshow again and share our experience and vision for the future of MEMS manufacturing with a new audience. We believe the topics presented at the Roadshow will be of great interest to participants in Europe where the MEMS/MST industry is particularly strong."
"STS and SUSS MicroTec combine all critical process steps in MEMS and MEMS Packaging", said Rolf Wolf, Managing Director of SUSS MicroTec Lithography division. "As MEMS is increasingly transferring new products into production, we believe this roadshow offers a platform for our customers to learn more about the latest trends in MEMS manufacturing."
The 'MEMS Technology: Embracing the Future' roadshow will begin in Grenoble
(F) on September 24 and move onto Eindhoven (NL) and Copenhagen (DK).
Presenters will provide an overview of the technologies currently available to support the most advanced MEMS processes.
More detailed information is available at www.memsroadshow.com
